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Layer count – up to 34 L

Maximum thickness – 200mils (5 mm)

Max panel size 24”x 36” (612 x 916mm)

Various board types:

Back panel , Line card, POFV,

Material Hybrid Technology

0.94mm Pitch+2Track+Backdrill

Gold finger and Segmented Gold finger

Impedance Control, SI, Skip via, Low loss solder mask and Back drilling

Dual connector and Smaller press fit hole size (0.32 mm)

Set2dil, Delta L 4.0, VNA measurement capabilities

0.5mm pitch BGA

Used for Entry level Server, Blade Server, Rack Server, Hyperscale Server & High performance computing