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High density designs

Max thickness 0.180”(4.5mm)

Max panel size 24X42”(612X1070mm)

Line/space to 3.0/3.0 mils (76um/76um, inner layers)

Min core 1.0 mils (25.0um)

Via in pad (POFV/VIPPO)

0.2mm drill size

0.5mm BGA

Various structure types

1.N+N;

2.N+N+N;

3.N+2+N

Processes available:

LDI (Laser Directing Image)

8 camera post-etch punch

CCD Back-drilling