Product details
Heat sinks(Metal-backed PCB)
Production since 2003
Hybrid or Teflon PCB’s
Bonded to thick Copper pallets ( 1mm – 5mm)
Large WPNL size
Experience with Pre-bonded, Post-bonded, Press fit, embedded and various coin designs
Coin assembly by Bonding film, PSA , Embedded coin & Press fit
Special team to support NPI and production
Special team to support NPI and production
Used in Power amplifiers or RF modules
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BP(Backplane)
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LC(Line Card)
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Server Products
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ANT(Antenna)
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HDI(Higth Density Interconnec)
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Hybrid Products
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Heat sinks(Metal-backed PCB)
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Heavy Copper
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