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Max thickness .374” (9.5 mm)

Max panel size 24X48” (612x1219mm)

M-Tg, Hi-Tg, low Dk/Df materials

Press fit holes

Controlled impedance

Backdrilling Multiple depths, both sides

BBlind vias, Dual Vias, Air via

BBlind press-fit holes

BCover PI-film on the surface

BImmersion Tin or OSP or ENIG

Reliability testing Thermal stress, IST, T-260

Used as backbone of network switches/routers, servers and basestations