產(chǎn)品詳情
Heat sinks(Metal-backed PCB)
Production since 2003
Hybrid or Teflon PCB’s
Bonded to thick Copper pallets ( 1mm – 5mm)
Large WPNL size
Experience with Pre-bonded, Post-bonded, Press fit, embedded and various coin designs
Coin assembly by Bonding film, PSA , Embedded coin & Press fit
Special team to support NPI and production
Special team to support NPI and production
Used in Power amplifiers or RF modules
-
![]()
BP(Backplane)
-
![]()
LC(Line Card)
-
![]()
Server Products
-
![]()
ANT(Antenna)
-
![]()
HDI(Higth Density Interconnec)
-
![]()
Hybrid Products
-
![]()
Heat sinks(Metal-backed PCB)
-
![]()
Heavy Copper
