產(chǎn)品詳情
Hybrid Products
Hybrid/Partial hybrid PCB’s
Production since Y2002
Up to 18 Layers
Innovative & Cost effective
designs
Experience with various
material mix
Power Amplifier for RF
application
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BP(Backplane)
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LC(Line Card)
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Server Products
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ANT(Antenna)
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HDI(Higth Density Interconnec)
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Hybrid Products
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Heat sinks(Metal-backed PCB)
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Heavy Copper
