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HDI = High Density Interconnect (Micro via)

Layer count –up to 34 L

Maximum thickness – 200mils (5.0mm)

Max panel size 24X36”(612X916mm)

Laser hole size : 3.9 ~ 16mil

Various structure types:

1+N+1

2+N+2

3+N+3

Various via types:

Staggered , Skip Vias 1-4, Stacked

Via-in-pad designs

Epoxy filled

Via filling

Plated over filled via (POFV/VIPPO)

Conformal, large window , DLD Process

Currently 14 Gauss +2 Top-hat CO2 laser drills

Used in hi-speed line cards