產(chǎn)品詳情
Server Products
Layer count – up to 34 L
Maximum thickness – 200mils (5 mm)
Max panel size 24”x 36” (612 x 916mm)
Various board types:
Back panel , Line card, POFV,
Material Hybrid Technology
0.94mm Pitch+2Track+Backdrill
Gold finger and Segmented Gold finger
Impedance Control, SI, Skip via, Low loss solder mask and Back drilling
Dual connector and Smaller press fit hole size (0.32 mm)
Set2dil, Delta L 4.0, VNA measurement capabilities
0.5mm pitch BGA
Used for Entry level Server, Blade Server, Rack Server, Hyperscale Server & High performance computing
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BP(Backplane)
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LC(Line Card)
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Server Products
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ANT(Antenna)
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HDI(Higth Density Interconnec)
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Hybrid Products
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Heat sinks(Metal-backed PCB)
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Heavy Copper
