產(chǎn)品詳情
BP(Backplane)
Up to 64 layers
Max thickness .374” (9.5 mm)
Max panel size 24X48” (612x1219mm)
M-Tg, Hi-Tg, low Dk/Df materials
Press fit holes
Controlled impedance
Backdrilling Multiple depths, both sides
BBlind vias, Dual Vias, Air via
BBlind press-fit holes
BCover PI-film on the surface
BImmersion Tin or OSP or ENIG
Reliability testing Thermal stress, IST, T-260
Used as backbone of network switches/routers, servers and basestations
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BP(Backplane)
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LC(Line Card)
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Server Products
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ANT(Antenna)
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HDI(Higth Density Interconnec)
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Hybrid Products
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Heat sinks(Metal-backed PCB)
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Heavy Copper
